Dispenser for chemical-mechanical polishing (CMP) apparatus, CMP apparatus having the dispenser, and CMP process using the CMP apparatus

摘要

A dispenser for a chemical-mechanical polishing (CMP) apparatus, includes a delivery arm disposed over a polishing pad of a CMP apparatus, at least a slurry delivery groove formed in the delivery arm and extending along a length of the delivery arm, and a plurality of first openings connected to the slurry delivery groove.