WAFER HANDLING APPARATUS FOR DAMAGE PREVENTION OF EDGE PART IN ELECTROPLATING PROCESS OF THINNING WAFER

摘要

The present invention relates to a wafer handling apparatus for preventing an edge portion from being damaged in plating a thin wafer. The wafer handling apparatus comprises: a transfer unit which transfers a thinned wafer to use TSV; and a fixing unit which places and fixes the wafer transferred by the transfer unit, wherein the transfer unit includes a transfer arm which is provided to rotate and move and a vacuum adsorption buffer pad which has a vacuum adsorption hole provided at an end of the transfer arm, and the fixing unit includes a fixing jig on which the wafer transferred by the transfer unit is placed, a contact fixing member which fixes the wafer by coming in contact with and supporting the upper face edge of the wafer placed on the fixing jig, and a pneumatic cylinder which controls the lifting movement of the contact fixing member, and applies tension to a pressing fixing member with pneumatic tension according to pneumatic supply, to mitigate the impact caused by the contact support at the time of coming in contact with the upper face of the wafer placed on the fixing jig by falling. Accordingly, it is possible to prevent a wafer from being damaged at the time of handling the wafer.