首页> 外文期刊>Components, Packaging and Manufacturing Technology, IEEE Transactions on >Foreword: Special Section on Advanced Packaging, Materials, Processing, and Reliability: Cutting-Edge Solutions for High-Density Wafer-/Panel-Level and Thin, Flexible, Mobile Packages

【24h】

Foreword: Special Section on Advanced Packaging, Materials, Processing, and Reliability: Cutting-Edge Solutions for High-Density Wafer-/Panel-Level and Thin, Flexible, Mobile Packages

机译：前言：高级包装，材料，加工和可靠性的专题部分：高密度晶片/面板级和薄，灵活，移动套件的尖端解决方案

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

页面导航

著录项
相似文献
相关主题

著录项

来源
《Components, Packaging and Manufacturing Technology, IEEE Transactions on》 |2020年第1期|3-4|共2页
作者
Bock Karlheinz;
展开▼
作者单位

Tech Univ Dresden D-01069 Dresden Germany;

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类
关键词
入库时间 2022-08-18 21:03:38

相似文献

外文文献
专利

1. Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization—Part II [J] . Telescu Mihai, Gu Xiaoxiong, Sharma Rohit Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2019,第10期

机译：前言：包装和互连特别部分：建模，设计和表征中的前沿解决方案—第二部分
2. Foreword: Special Section on “The Reliability of Advanced Microelectronic Packaging—Part II: Structure–Property Relationships” [J] . Qin Wentao, Li Yan Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2020,第10期

机译：前言：特别部分“先进微电子包装的可靠性 - 第二部分：结构 - 财产关系”
3. Process Modules for High-Density Interconnects in Panel-Level Packaging [J] . Schein Friedrich-Leonhard, Kahle Ruben, Kunz Marc, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2020,第1期

机译：面板级包装中高密度互连的处理模块
4. Design, Materials, Process, Fabrication, and Reliability of Mini-LED RGB Display by Fan-Out Panel-Level Packaging [C] . John H Lau, Cheng-Ta Ko, Curry Lin, IEEE Electronic Components and Technology Conference . 2021

机译：通过扇出面板级包装设计，材料，工艺，制造和迷你LED RGB显示器的可靠性
5. Effect of high-pressure processing for packaged foods on the mass transfer and mechanical characteristics of the flexible packaging materials. [D] . Caner, Cengiz. 2002

机译：包装食品的高压处理对软包装材料的传质和机械特性的影响。
6. The Effect of Moisture on Cellulose Nanocrystals Intended as a High Gas Barrier Coating on Flexible Packaging Materials [O] . Ghislain Fotie, Riccardo Rampazzo, Marco Aldo Ortenzi, 2016

机译：水分对纤维素纳米晶体在软包装材料上作为高阻气涂层的影响
7. Foreword: Special Section on Advanced Packaging, Materials, Processing, and Reliability: Cutting-Edge Solutions for High-Density Wafer-/Panel-Level and Thin, Flexible, Mobile Packages [O] . Karlheinz Bock 2020

机译：前言：高级包装，材料，加工和可靠性的专题部分：高密度晶片/面板级和薄，灵活，移动套件的尖端解决方案

获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

客服微信
服务号