Ag ALLOY SPUTTERING TARGET, METHOD OF MANUFACTURING Ag ALLOY SPUTTERING TARGET, Ag ALLOY FILM, AND METHOD OF FORMING Ag ALLOY FILM

摘要

An Ag alloy sputtering target of the present invention includes, as a composition, 0.1 at % to 3.0 at % of Sn, 1.0 at % to 10.0 at % of Cu, and a balance of Ag and inevitable impurities. In addition, an Ag alloy film of the present invention includes, as a composition, 0.1 at % to 3.0 at % of Sn, 1.0 at % to 10.0 at % of Cu, and a balance of Ag and inevitable impurities.