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STABILIZED TRANSIENT LIQUID PHASE METAL BONDING MATERIAL FOR HERMETIC WAFER LEVEL PACKAGING OF MEMS DEVICES
STABILIZED TRANSIENT LIQUID PHASE METAL BONDING MATERIAL FOR HERMETIC WAFER LEVEL PACKAGING OF MEMS DEVICES
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机译:用于MEMS设备的密封晶片级封装的稳定瞬态液态金属键合材料
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摘要
In described examples, a transient liquid phase (TLP) metal bonding material includes a first substrate and a base metal layer. The base metal layer is disposed over at least a portion of the first substrate. The base metal has a surface roughness (Ra) of between about 0.001 to 500 nm. Also, the TLP metal bonding material includes a first terminal metal layer that forms an external surface of the TLP metal bonding material. A metal fuse layer is positioned between the base metal layer and the first terminal metal layer. The TLP metal bonding material is stable at room temperature for at least a predetermined period of time.
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