首页>
外国专利>
Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy
Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy
展开▼
机译:用于低温冶金的MEMS器件的密封晶圆级封装
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method is disclosed for making a wafer-level package for a plurality of MEMS devices. The method involves preparing a MEMS wafer and a lid wafer, each having respective bonding structures. The lid and MEMS wafers are then bonded together through the bonding structures. The wafers are substantially free of alkali metals and/or chlorine. IN a preferred embodiment, each wafer has a seed layer, a structural underlayer and an anti-oxidation layer. A solder layer, normally formed on the lid wafer, bonds the two wafers together.
展开▼