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Enhanced density assembly having microelectronic packages mounted at substantial angle to board
Enhanced density assembly having microelectronic packages mounted at substantial angle to board
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机译:具有微电子封装的增强密度组件,该微电子封装相对于电路板成一定角度安装
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摘要
A microelectronic assembly includes a plurality of stacked microelectronic packages, each comprising a dielectric element having a major surface, an interconnect region adjacent an interconnect edge surface which extends away from the major surface, and plurality of package contacts at the interconnect region. A microelectronic element has a front surface with chip contacts thereon coupled to the package contacts, the front surface overlying and parallel to the major surface. The microelectronic packages are stacked with planes defined by the dielectric elements substantially parallel to one another, and the package contacts electrically coupled with panel contacts at a mounting surface of a circuit panel via an electrically conductive material, the planes defined by the dielectric elements being oriented at a substantial angle to the mounting surface.
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