Optimal Thermo-Structural Analysis for High Density Package Mounting on Build-up Board

摘要

The importance of the high density packaging technology and mounting technology on the printed wiring build-up board has been increased for the consumer electric products. On the other hand, the chance to use the build-up boards for mounting the high density packages has been increased. However, the understanding that the reliability of the solder connection depends on the structure of the package, the motherboard, and the material properties, is not very high. In this paper, the reliability for high density packaging, mounted on the build-up board, is assessed. The compact numerical analysis model for the reliability assessment is suggested and the most reliable packaging design with optimizing each of the parameters is reported. For introduction to the reliability assessment of the FCA attachment, ceramic and silicon are compared as the inter-poser with the parameter of the solder height. The verification of the numerical analysis results using tests on the actual hardware is also shown. And the established numerical analysis model is applied to the study of influence of the copper balance between the front side and the back side copper layers.