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Trends of Technologies in Build-Up Type Multilayer Boards-Key Technology for High Density Packaging. Present and Future of Technologies for Build-Up Type Multilayer Boards.

机译：用于高密度包装的建筑型多层电路板关键技术技术趋势。建筑型多层板技术的现状与未来。

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Susumu HONDA;
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年度 1996
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1. Technology Trend of Build-up Printed Wiring Board [J] . Keisuki Okada NEC技報 . 1999,第10期

机译：组合印刷线路板的技术趋势
2. Multilayer thin-film technology enabling technology for solving high-density interconnect and assembly problems [J] . Eric Beyne Nuclear Instruments & Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment . 2003,第1a3期

机译：多层薄膜技术使技术能够解决高密度互连和组装问题
3. Millimeter-Wave Horn-Type Antenna-in-Package Solution Fabricated in a Teflon-Based Multilayer PCB Technology [J] . Enayati A., Vandenbosch G.A.E., DeRaedt W. Antennas and Propagation, IEEE Transactions on . 2013,第4期

机译：基于聚四氟乙烯的多层PCB技术制造的毫米波喇叭型封装天线解决方案
4. A study on the multilayer π-type thermoelectric power generation module using the metal direct bonding technology [C] . Hiroshi Sato, So Baba, Tetsuro Yanaseko, Conference on smart materials and nondestructive evaluation for energy systems . 2016

机译：金属直接粘接技术的多层π型热电发电模块的研究
5. Microlamination Based Lumped and Distributed Magnetic MEMS Systems Enabled by Through-Mold Sequential Multilayer Electrodeposition Technology [D] . Li, Yuan. 2018

机译：通过模具顺序多层电沉积技术实现的微氧化块和分布磁性MEMS系统
6. Direct Synthesis of Large-Scale Multilayer TaSe2 on SiO2/Si Using Ion Beam Technology [O] . Hsu-Sheng Tsai, *, ‡, 2019

机译：离子束技术在SiO2 / Si上直接合成大规模多层TaSe2
7. Trends of Technologies in Build-Up Type Multilayer Boards-Key Technology for High Density Packaging. Build-Up Multilayer Board with Full Additive Technology. [O] . Yoshinori TAKAZAKI 1996

机译：用于高密度包装的建筑型多层电路板关键技术技术趋势。带全部添加剂技术的积聚多层板。

Trends of Technologies in Build-Up Type Multilayer Boards-Key Technology for High Density Packaging. Present and Future of Technologies for Build-Up Type Multilayer Boards.

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