首页> 外国专利> LASER ANNEALING METHOD, LASER ANNEALING DEVICE, AND METHOD FOR MANUFACTURING THIN-FILM TRANSISTOR

LASER ANNEALING METHOD, LASER ANNEALING DEVICE, AND METHOD FOR MANUFACTURING THIN-FILM TRANSISTOR

机译:激光退火方法,激光退火装置以及薄膜晶体管的制造方法

摘要

The present invention is a laser annealing method for irradiating an amorphous silicon thin film 7 bonded to a substrate (5) with laser light L to form polysilicon, wherein multiple irradiation is carried out by changing the region on the amorphous silicon thin film 7 on which the laser light L is irradiated, and a grain diameter distribution is produced such that the crystal grain diameter of the polysilicon decreases from a central part toward a side-end part along at least the central axis C of the region on which the laser light L is irradiated. This makes it possible to realize a laser annealing method in which it is possible to reduce leakage current using a simple process.
机译:本发明是一种激光退火方法,其用激光L照射粘合到基板(5)上的非晶硅薄膜7以形成多晶硅,其中,通过改变非晶硅薄膜7上的区域来进行多次照射。照射激光L,以使多晶硅的结晶粒径至少沿着激光L的区域的中心轴C从中央部向侧端部减小的方式产生粒径分布。被照射。这使得可以实现一种激光退火方法,其中可以使用简单的工艺减小泄漏电流。

著录项

  • 公开/公告号WO2016186043A1

    专利类型

  • 公开/公告日2016-11-24

    原文格式PDF

  • 申请/专利权人 V TECHNOLOGY CO. LTD.;

    申请/专利号WO2016JP64345

  • 发明设计人 MIZUMURA MICHINOBU;

    申请日2016-05-13

  • 分类号H01L21/20;H01L21/268;H01L21/336;H01L29/786;

  • 国家 WO

  • 入库时间 2022-08-21 13:33:53

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