METHOD FOR POLISHING BOTH SIDES OF SEMICONDUCTOR WAFER AND APPARATUS FOR POLISHING BOTH SIDES OF SEMICONDUCTOR WAFER

摘要

A method for polishing both sides of a semiconductor wafer according to the present invention comprises: detecting a load current value of a sun gear or a load current value of an internal gear when both sides of the semiconductor wafer are polished at the same time; calculating a load factor of the sun gear or a load factor of the internal gear from the detected load current value of the sun gear or the detected load current value of the internal gear; and determining, as a polishing endpoint, the time point at which the calculated load factor of the sun gear or the calculated load factor of the internal gear reaches a local minimum value.