THICKNESS DISTRIBUTION MEASUREMENT SYSTEM OF SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER POLISHING SYSTEM, THICKNESS DISTRIBUTION MEASUREMENT METHOD OF SEMICONDUCTOR WAFER AND THICKNESS ALLOWANCE DISTRIBUTION MEASUREMENT METHOD, AND POLISHING METHOD OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a thickness distribution measurement system of a semiconductor wafer capable of measuring the thickness distribution of a semiconductor wafer conveniently and accurately, while gripping the semiconductor wafer by means of a robot hand, and capable of deploying to many devices easily.SOLUTION: A thickness distribution measurement system 100 of a semiconductor wafer includes a carry-in section 10, a storage section 30, a measurement section 50, and a transport section 70. The transport section 70 has a robot arm 72, a pedestal 74 provided at the tip 72b thereof, a robot hand 76 for gripping a semiconductor wafer W, and a transport control section 78. The measurement section 50 has a measurement sensor 52, a linear scale 54, and a measurement control section 56 for synchronizing the travel of a rod 54R and the measured value per unit time of the thickness of the semiconductor wafer W by the measurement sensor 52.SELECTED DRAWING: Figure 1