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THERMAL VIAS IN AN INTEGRATED CIRCUIT PACKAGE WITH AN EMBEDDED DIE
THERMAL VIAS IN AN INTEGRATED CIRCUIT PACKAGE WITH AN EMBEDDED DIE
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机译:集成电路板封装中的热通道
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摘要
In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded within a package substrate having thermal vias, and the thermal vias are coupled to some of the package contacts with hot spots on the embedded die.
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