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THERMAL VIAS IN AN INTEGRATED CIRCUIT PACKAGE WITH AN EMBEDDED DIE
THERMAL VIAS IN AN INTEGRATED CIRCUIT PACKAGE WITH AN EMBEDDED DIE
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机译:集成电路板封装中的热通道
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摘要
In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded in the package substrate with thermal vias that couple hotspots on the embedded die to some of the package contacts.
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