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Packaging for high power integrated circuits and infrared emitter arrays

机译:大功率集成电路和红外发射器阵列的包装

摘要

A product and method for packaging high power integrated circuits or infrared emitter arrays for operation through a wide range of temperatures, including cryogenic operation. The present invention addresses key limitations with the prior art, by providing temperature control through direct thermal conduction or active fluid flow and avoiding thermally induced stress on the integrated circuits or emitter arrays. The present invention allows for scaling of emitter arrays up to extremely large formats, which is not viable under the prior art. The present invention eliminates or otherwise reduces risks associated with vaporization of coolant within the heatsink structure.
机译:一种产品和方法,用于包装大功率集成电路或红外发射器阵列以在很宽的温度范围内运行,包括低温运行。本发明通过直接热传导或主动流体流动来提供温度控制,并避免了集成电路或发射器阵列上的热致应力,从而解决了现有技术的关键限制。本发明允许将发射器阵列按比例缩放到非常大的格式,这在现有技术下是不可行的。本发明消除了或以其他方式降低了与散热器结构内的冷却剂汽化有关的风险。

著录项

  • 公开/公告号US10051735B2

    专利类型

  • 公开/公告日2018-08-14

    原文格式PDF

  • 申请/专利权人 OLESON CONVERGENT SOLUTIONS LLC;

    申请/专利号US201715797233

  • 发明设计人 JIM OLESON;

    申请日2017-10-30

  • 分类号H01L23/34;H05K1/11;H01L23/473;H01L23/12;H01L23;H01L25/07;

  • 国家 US

  • 入库时间 2022-08-21 13:05:04

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