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首页> 外文期刊>European Journal of Applied Mathematics >Derivation of the maximum voltage drop in power grids of integrated circuits with an array bonding package
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Derivation of the maximum voltage drop in power grids of integrated circuits with an array bonding package

机译:用阵列键合封装推导集成电路电网中的最大压降

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In this work we derive a formula for the maximum value of the voltage drop that takes place in power grids of integrated circuits with an array bonding package. We consider a simplified model for the power grid where the voltage is represented as the solution of the Poisson's equation in an infinite planar domain with a regularly aligned array of small square pads where the voltage is set to be zero. We study the singular limit where these pads' size tends to be zero and we derive an asymptotic formula in terms of a power series in ε, being 2ε the side of the square. We also discuss pads of more general shapes, for which we provide an expression for the leading order term. To deduce all these formulae we use the method of matched asymptotic expansions using an iterative scheme, along with conformal maps to compare this problem with the corresponding one when the pads are circular.
机译:在这项工作中,我们推导了带有阵列键合封装的集成电路电网中发生的压降最大值的公式。我们考虑一种简化的电网模型,其中电压表示为无限平面域中的泊松方程的解,具有规则排列的小正方形焊盘阵列,其中电压设置为零。我们研究了这些垫的大小趋于零的奇异极限,并根据幂级数ε得出了一个渐近公式,该幂级数是正方形的2ε。我们还讨论了更通用形状的垫,为此我们提供了前导术语的表达。为了推导所有这些公式,我们使用了一种采用迭代方案的匹配渐近展开方法,以及保形贴图,以在垫块为圆形时将此问题与相应的问题进行比较。

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