METHOD AND DEVICE FOR TREATING THE UNDERSIDE OF A SUBSTRATE

摘要

A method for treating the underside of a planar substrate with a treatment medium includes hydrophobizing the underside of the substrate, subsequently forming a protective liquid film on a top side of the substrate and then bringing the treatment medium into contact with the underside of the substrate. In the process, the protective liquid film protects the upper side of the substrate from any action or effect of the treatment medium and/or outgassing. A device for carrying out the method is also provided.