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Package on Package Structure Having Package To Package Interconnect Composed of Packed Wires Having A Polygon Cross Section
Package on Package Structure Having Package To Package Interconnect Composed of Packed Wires Having A Polygon Cross Section
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机译:封装结构上的封装,具有封装到封装的互连,该互连由具有多边形横截面的填充导线组成
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摘要
An apparatus is described that includes a package on package structure. The package on package structure includes an interposer to implement electrical interconnections between an upper package of the package on package structure and a lower package of the package on package structure. The interposer has packed wires, the packed wires have respective polygonal cross sections.
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