Technologies for combining CMP process trace data with 3D-printed CMP consumables

摘要

Methods of manufacturing chemical mechanical polishing (CMP) devices and CMP devices are provided herein. The CMP apparatus may include, among other things, polishing pads, polishing head retaining rings, and polishing head membranes, and the CMP apparatus may be fabricated through laminate manufacturing processes such as three-dimensional (3D) printing processes. The CMP device may include wireless communication device components integrated therein. Methods of manufacturing a CMP apparatus include 3D printing of a wireless communication device in a polishing pad, and printing of a polishing pad having a recess configured to receive a preformed wireless communication device.