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Techniques for combining CMP process tracking data with 3D printed CMP consumables
Techniques for combining CMP process tracking data with 3D printed CMP consumables
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机译:用于将CMP过程跟踪数据与3D打印CMP消耗品组合的技术
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摘要
Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
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