Techniques for combining CMP process tracking data with 3D printed CMP consumables

摘要

This document provides a chemical mechanical polishing (CMP) apparatus and method for manufacturing a CMP apparatus. The CMP apparatus may include, among other things, a polishing pad, a polishing head retaining ring, and a polishing head film, and the CMP apparatus may be manufactured through an additive manufacturing process such as a three-dimensional (3D) printing process. The CMP apparatus can integrally include components of the wireless communication apparatus. A method of manufacturing a CMP apparatus includes 3D printing a wireless communication device in a polishing pad and printing a polishing pad having a recess configured to receive a pre-formed wireless communication device. [Selection] Figure 6