To provide a CMP polishing pad having one or more endpoint detection windows for ensuring that no leak occurs, and a method for making the same.SOLUTION: In a chemical mechanical (CMP) polishing pad including a top surface, one or more apertures adapted to receive an endpoint detection window 14, an underside part having a recessed portion and having one or more flanged endpoint detection windows (windows), each window has a flange adapted to fit snugly into the recessed portion of the underside part of a polishing layer, the flange has thickness slightly less than depth of the recessed portion of the polishing layer (to allow for adhesive), has a detection area that fits snugly into an aperture in the polishing layer so that its top surface lies substantially flush with the top surface of the polishing layer.SELECTED DRAWING: Figure 1
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