A Novel Tungsten CMP Process with Soft Pad and Optical Endpoint System Control

摘要

A novel W-CMP two-step process using 1:1 diluted slurry, 2.5% H_2O_2 concentration, soft pad and optical endpoint system was developed in this work. The soft pad process demonstrates that lower cost of consumables, better uniformity, sufficient process window and comparable performance of oxide erosion, dishing and via resistance are achieved.