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Flanged optical endpoint detection windows and CMP polishing pads containing them
Flanged optical endpoint detection windows and CMP polishing pads containing them
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机译:法兰式光学端点检测窗口和包含它们的CMP抛光垫
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摘要
The present invention provides a chemical mechanical (CMP) polishing pad with a top surface, one or more apertures adapted to receive an endpoint detection window, an underside having a recessed portion and having one or more flanged endpoint detection windows (windows), each window having a flange adapted to fit snugly into the recessed portion of the underside of the polishing layer, the flange having a thickness slightly less than the depth of the recessed portion of the polishing layer (to allow for adhesive), having a detection area that fits snugly into an aperture in the polishing layer so that its top surface that lies substantially flush with the top surface of the polishing layer.
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