Fabrication and integration of III-V chips in silicon photonics

摘要

A compound semiconductor laser is manufactured by securing a III-V wafer to a transfer wafer. With the III-V wafer secured to the transfer wafer, the substrate of the III-V wafer is removed and the III-V wafer is etched into multiple chips. The transfer wafer is separated into single pieces. A portion of the transfer wafer is used as a handle to bond the chip to the recess of the silicon device. The chip is used as a gain medium for semiconductor lasers. [Selected figure] Figure 14