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Metal plating layer of copper powder, metal substrate, energy saving heat dissipation device capable of preventing expansion and explosion, and manufacturing process thereof
Metal plating layer of copper powder, metal substrate, energy saving heat dissipation device capable of preventing expansion and explosion, and manufacturing process thereof
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机译:铜粉的金属镀层,金属基板,能够防止膨胀和爆炸的节能散热装置及其制造工艺
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摘要
The invention provides a preparation process of a copper powder metal coating, a metal substrate with the metal coating, an energy-saving and anti-burst heat-dissipation device and a preparation process thereof. The preparation process of the copper powder metal coating comprises the step of metal layer adhesion. During adhesion, the temperature of liquid in a working tank is 1-15 DEG C. The stepof metal layer adhesion at least comprises the processes of adhesion of a base coat, adhesion of a snowflake-shaped metal layer and adhesion of a fastening layer, and the metal layer which is obtainedby adhesion and has a snowflake-shaped structure is large in capillary force and good in evaporating property. The metal substrate with the copper powder metal coating and the energy-saving and anti-burst heat-dissipation device are energy-saving and environmentally friendly in the preparation process, and have the large capillary force and good evaporating property; the hardness of the metal substrate can be maintained; and the swelling resistance is good. The thickness of the energy-saving and anti-burst heat-dissipation device can be 0.3 mm, and the technological difficulty that the thickness of a heat tube heat-dissipation device in the prior art only can be 0.6 mm is solved.
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