Copper powder metal plating layer metal substrate energy-saving anti-burst heat dissipation device and preparation process thereof

摘要

The present invention provides a copper powder metal conductive layer, a metal substrate, energy-saving explosion-proof heat dissipation device and a manufacturing process thereof. The manufacturing process of the copper powder metal plating layer, step c. Attaching a metal layer; The temperature of the liquid in the working tank at the time of attachment is 1-15 ° C., and the attachment metal layer includes at least a base layer attachment, a snowflake-shaped metal layer attachment, and a rigid layer attachment process to obtain a metal layer having a snowflake-shaped structure by attachment. The capillary force is strong and the evaporation performance is good. The metal substrate having the copper powder metal plating layer, and the energy-saving explosion-proof heat dissipation device is characterized in that the manufacturing process is energy-saving, environmentally friendly, strong capillary force, good evaporation performance, can maintain the hardness of the metal substrate, expansion performance Is good. The energy-saving explosion-proof heat dissipation device can implement a product having a thickness of 0.3mm, solving the technical bottleneck that can only implement a heat pipe heat dissipation device of 0.6mm thickness in the prior art.