PACKAGE EMI FOR SEMICONDUCTOR

摘要

The present invention relates to the EMI package of a wireless communication chip used in a smartphone such as LGA to BGA package. It is a process for coating metal directly on the surface of a package and using electroless plating using metal nanopowder. Particularly, the plating is carried out while protecting the electrode on the bottom of the semiconductor chip package using a release adhesive. A metal nonopowerder layer is formed in the upper part and the side surface of the package of a semiconductor chip. Metal coating is performed on the metal nonopowerder layer.;COPYRIGHT KIPO 2019