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Polymer Nanocomposites Containing Semiconductors as Advanced Materials for EMI Shielding

机译:含有半导体的聚合物纳米复合材料作为EMI屏蔽的先进材料

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摘要

Miniaturization of electronic devices and systems enhances the complexity of inbuilt circuitry, thereby giving rise to electromagnetic interference (EMI). EMI is a serious cause of concern as it affects the performance of a device, transmission channel, or system. In a quest to find an effective solution to this problem, several materials, apart from the conventional metals, such as carbon derivatives, have been extensively explored recently. In addition to carbon derivatives, hybrid structures such as core–shell, conjugated systems, etc. have also been researched. However, semiconducting fillers have received less attention, especially in this application. Hence, this review article will primarily focus on the systematic understanding of the use of semiconductor-based polymer nanocomposites and how the band gap plays a crucial role in deciding the dielectric properties and subsequently the electromagnetic absorption behavior for shielding applications. Our primary aim is to highlight the mechanism of shielding involved in such nanocomposites in addition to discussing the synthesis and properties that lead to effective shielding. Such nanocomposites containing semiconductors can pave the way for alternate materials for EMI shielding applications that are lightweight, flexible, and easy to integrate.
机译:电子设备和系统的小型化提高了内置电路的复杂性,从而产生了电磁干扰(EMI)。 EMI是一个严重的关注原因,因为它影响了设备,传输信道或系统的性能。在寻求对这个问题的有效解决方案中,几种材料,除了传统金属(如碳衍生物)最近已被广泛探讨。除了碳衍生物之外,还研究了核心 - 壳,共轭系统等混合结构。然而,半导体填料已经不太关注,特别是在本申请中。因此,本综述文章主要关注对使用半导体基聚合物纳米复合材料的系统理解以及带隙如何在决定介电性质方面发挥至关重要作用,并随后用于屏蔽应用的电磁吸收行为。除了讨论导致有效屏蔽的合成和性质之外,我们的主要目标是突出突出涉及这种纳米复合材料的屏蔽机制。含有半导体的这种纳米复合材料可以为EMI屏蔽应用的交替材料铺平,这是重量轻,灵活,易于集成的。

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