Method of manufacturing warpage corrector and fanout wafer level package

摘要

[PROBLEMS] To provide a warpage correction material capable of reducing warpage of the WLP by adjusting the warpage amount at the temperature at the time of mounting the fan-out wafer level package (FO-WLP) or at room temperature such as wafer conveyance. [Solution] A warp correction material for a fan-out wafer level package, comprising a curable resin composition containing an active energy ray and a component that can be cured by heat, and curing the warp correction material with an active energy ray and heat. When the cured product is formed into a flat film, the linear expansion coefficient α (ppm / ° C.) at 25 ° C., elastic modulus β (GPa) at 25 ° C., and thickness γ (μm) at 25 ° C. are represented by the following relational formula: It is characterized by satisfying 2000 ≦ α × β × γ ≦ 10000.