POLISHING HEAD, SUBSTRATE POLISHING DEVICE COMPRISING POLISHING HEAD, AND SUBSTRATE TREATMENT APPARATUS COMPRISING SUBSTRATE POLISHING DEVICE

摘要

To keep a state of a polishing pad surface uniform.SOLUTION: A polishing head 302 for holding a substrate WF to be polished is provided. The polishing head 302 comprises a rotary head 304 that is rotatably constituted, and a stationary head 306. The rotary head 304 has a substrate holding surface for holding the substrate WF, and a first retainer member 324 that is arranged around the substrate holding surface. The stationary head 306 has a second retainer member 332 that is arranged around the first retainer member 324.SELECTED DRAWING: Figure 5