High Removal Rate Ultra-Smoothness Polishing of NiP Plated Aluminum Magnetic Disk Substrate by Means of High Polishing Speed with High Polishing Pressure

摘要

The main results obtained are as follows: (1) The substrate removal rate becomes larger f higher polishing speed and pressure. (2) The slight undulation and the surface roughness converge finally to a terminal value corresponding to a given polishing condition. (3) The polishing pressure has little influence on the terminal slight undulation and the surface roughness. (4) The terminal surface roughness is influenced little by polishing speed (5) The terminal slight undulation of about 0.47nm(Ra) at Va=9m/s using alumina abrasives of 50nm diameter is becomes somewhat larger than that of about 0.37nm(Ra) at Va=1.5m/s. (6) The surface smoothness and the removal rate at Va = 9m/s using alumina abrasives of 50nm diameter is smoother and larger than those at 1.5m/s using alumina abrasives of 0.5μm diameter.