CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING SUBSTRATE RECEIVING MEMBER

摘要

A carrier head for a chemical mechanical polishing apparatus comprises: a base; a substrate receiving member comprising a plate portion having an outer surface for receiving a substrate and an inner surface at the back of the outer surface, a perimeter portion extended in a height direction from an edge of the plate portion, a securing portion extended from an outer part of the perimeter portion and connected to a lower part of the base, and a contact portion extended from an inner part of the perimeter portion; a contact coupling structure connected to the lower part of the base to provide a contact surface to the contact portion; and a perimeter portion pressurizing chamber formed by taking the securing portion and the contact portion as chamber walls when the contact portion contacts firmly the contact coupling structure by means of fluid pressure.