Solder alloy, solder powder, solder paste, and solder joints using these

摘要

A solder alloy, a solder powder, etc., which suppresses a change with time of a solder paste, has excellent wettability, has a small temperature difference between a liquidus temperature and a solidus temperature, has high mechanical properties, and exhibits high bonding strength. I will provide a. SOLUTION: Solder alloy: Cu: 0.55 to 0.75% by mass, Ni: 0.0350 to 0.0600% by mass, Ge: 0.0035 to 0.0200% by mass, As: 25 to 300% by mass ppm, and at least one of Sb: 0 to 3000 mass ppm, Bi: 0 to 10000 mass ppm, and Pb: 0 to 5100 mass ppm, and the balance being an alloy composition consisting of Sn. Equation (2) is satisfied. 275 ≦ 2As + Sb + Bi + Pb (1), 0.01 ≦ (2As + Sb) / (Bi + Pb) ≦ 10.00 (2) [In the above formulas (1) and (2), As, Sb, Bi, and Pb are alloy compositions, respectively. Represents the content (mass ppm). ] [Selection figure] None