Problem to be solved: to suppress the increase in viscosity of the solder paste over time and to prevent the short circuit of the circuit, to increase the mechanical strength of the solder joint, to suppress the occurrence of soft errors, and to prevent the occurrence of soft errors, solder powder made of this solder alloy Solder paste, solder ball, solder preform and solder joint containing the solder powder are provided.The present invention is not limited to u: 5 mass ppb, th: 5 mass ppb, Pb: 5 mass ppm, less than 5 mass ppm, Ni: 0 mass ppm or more than 600 mass ppm, and Fe: 0 mass ppm or more than 100 mass ppm or less The alloy has an alloy composition consisting of Sn and the remainder of Sn and satisfies the equation (1) and α A solder alloy having a dose of 0.02 CPH / cm2 or less is employed.20. Leq. Ni + Fe. Leq. 700 (1)In the formula (1), Ni and Fe represent the content (mass ppm) in the alloy composition.No selection
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