Plating apparatus for printed wiring board and method for manufacturing printed wiring board

摘要

PROBLEM TO BE SOLVED: To provide a printed wiring board plating device capable of making thickness of plating layers uniform.SOLUTION: Provided is a printed wiring board plating device 1 which includes: a plating tank 2 for retaining a plating solution Y; a fixing jig 3 which is soaked in the plating solution Y and fixes a printed wiring board original plate that forms a cathode; an anode 4 which is soaked in the plating solution Y and provided by opposing to the printed wiring board original plate; and a mechanism 5 which applies a voltage to the anode 4 and the printed wiring board original plate. In the printed wiring board plating device 1, the anode 4 has a plurality of opposing faces 6a, 7a which oppose to the printed wiring board original plate, and current densities of the plurality of opposing faces 6a, 7a are different. The anode 4 has the first opposing face 6a and the second opposing face 7a having different distances with respect to the printed wiring board original plate, and the second opposing face 7a may better be disposed to surround the first opposing face 6a.SELECTED DRAWING: Figure 1