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Special Articles: Plating for Printed Wiring Boards. Plating on Manufacturing of PWB.

机译：特殊用品：印刷线板电镀。电镀PWB制造。

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Susumu MURAMATSU;
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年度 1993
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1. Improvement of copper plating adhesion of PPE printed wiring board by plasma treatment [J] . Ikari S, Kashiwade H, Matsuoka T, Surface & Coatings Technology . 2008,第22a23期

机译：通过等离子处理改善PPE印刷线路板的镀铜附着力
2. You've Come a Long Way, Baby/Acid copper plating evolves form early days of double-and single-sided printed wiring boards [J] . George Milad Metal finishing . 2005,第2期

机译：您已经走了很长一段路，婴儿/酸性镀铜从双面印刷线路板的早期发展而来
3. Determination and Monitoring of Through Hole Diameters in Printed Wiring Boards During Electrolytic Plating Using Acoustic Diffraction [J] . Tobias P. Berndt, Robert E. Green Jr. Materials Evaluation . 1998,第10期

机译：声学衍射法测定电镀线路板通孔直径的方法
4. Stable non-cyanide electroless gold plating which is applicable to manufacturing of fine pattern printed wiring boards [C] . Inoue, T., Ando, Electronic Components and Technology Conference, 1995. Proceedings., 45th . 1995

机译：稳定的无氰化学镀金，适用于精细图案印刷线路板的制造
5. A surrogate measure of customer satisfaction in the manufacture of Printed Wiring Boards. [D] . Maamoun, Adam Y. 2008

机译：印刷线路板制造中客户满意度的替代指标。
6. Management of Mandible Fracture by Plating and Wiring: An Otolaryngologist Perspective at Teritiary Care Center [O] . Sushil G. Jha, Vikas Sinha, T. U. Samanth, 2019

机译：通过电镀和布线管理下颌骨骨折：第三级护理中心的耳鼻喉科医师视角
7. Special Articles: Plating for Printed Wiring Boards. Chemistry of Electroplating. [O] . Kunio CHIBA 1993

机译：特殊用品：印刷线板电镀。电镀化学。
8. Carbon Black Dispersion Pre-Plating Technology for Printed Wire Board Manufacturing. Final Technology Evaluation Report [R] . Folsom, D. W., Gavaskar, A. R., Jones, J. A., 1993

机译：印刷线路板制造用炭黑分散预镀技术。最终技术评估报告

Special Articles: Plating for Printed Wiring Boards. Plating on Manufacturing of PWB.

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