SHEET FOR MANUFACTURING PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD USING THE SHEET FOR MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a sheet for manufacturing a printed wiring board, which can realize with high yield that LCR of high precision and a radio wave absorbing component layer are built in a resin circuit board with a simple process at a low cost by using a general-purpose sheet.;SOLUTION: When a printed wiring board formed by laminating and molding a support layer 2, a metal layer 3, a passive component forming layer 4 and a metal layer 5 in this order is manufactured, the laminating and molding are performed in the state that the metal layers 3, 5 and the passive component forming layer 4 are retained by the support layer 2, and the metal layer 3 is not patterned of the support layer 2. As a result, deformation and crack of the passive component forming layer 4 are restrained in the case of molding. Circuit components such as a capacitor, an inductor, a resistor and a radio wave absorbing component layer are formed by using the metal layers 3, 5 and the passive component forming layer 4. Thereby the circuit components are built on the printed wiring board, and the passive component forming layer 4 which is thin can be formed precisely with high yield.;COPYRIGHT: (C)2002,JPO