The present invention addresses the problem of providing a printed circuit board wiring-integrated sheet, a printed circuit board formed using this printed circuit board wiring-integrated sheet, and a manufacturing method for this printed circuit board wiring-integrated sheet, which is able effectively to prevent swelling in the conductive metal layers on the obverse and reverse sides of the base layer during high-temperature treatment in which a thermal imidisation reaction occurs. The printed circuit board wiring-integrated sheet (1) has a partially connected plurality of printed circuit board wiring-forming regions (30) including a non-conductive region (32), and a partially connected outside frame region (10). The printed circuit board wiring-forming regions (30) and the outside frame region (10) include a base layer (2), a conductive metal layer (3), and an insulating layer (4). The insulating layer (4) is formed via a thermal imidisation reaction, and at least one of either the non-conductive region (32) or the outside frame region (10) has a portion whose length is greater than 10 mm on which the conductive metal layer (3) has been laminated on both the obverse and reverse sides of the base layer (2), and a plurality of through-holes (K) are provided in the conductive metal layers (3) in this portion.
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