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Method for making a semiconductor device including non-monocrystalline stringer adjacent a superlattice-sti interface

机译:包括与超晶格-sti界面相邻的包括非单晶桁条的半导体器件的制造方法

摘要

A method for making a semiconductor device may include forming first and second spaced apart shallow trench isolation (STI) regions in a semiconductor substrate, and forming a superlattice on the semiconductor substrate and extending between the first and second STI regions. The superlattice may include stacked groups of layers, each group of layers including stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The method may also include forming a first semiconductor stringer comprising a non-monocrystalline body at an interface between a first end of the superlattice and the first STI region, and forming a gate above the superlattice.
机译:用于制造半导体器件的方法可以包括在半导体衬底中形成第一和第二间隔开的浅沟槽隔离(STI)区域,以及在半导体衬底上形成超晶格并且在第一和第二STI区域之间延伸。超晶格可包括堆叠的层组,每组层包括限定基础半导体部分的堆叠的基础半导体单层,以及约束在相邻基础半导体部分的晶格内的至少一个非半导体单层。该方法还可包括在超晶格的第一端和第一STI区域之间的界面处形成包括非单晶体的第一半导体纵梁,以及在超晶格上方形成栅极。

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