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首页> 外文期刊>Microelectronic Engineering >Analysis of interface trap density of metal-oxide-semiconductor devices with Pr_2O_3 gate dielectric using conductance method
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Analysis of interface trap density of metal-oxide-semiconductor devices with Pr_2O_3 gate dielectric using conductance method

机译:用电导法分析含Pr_2O_3栅介质的金属氧化物半导体器件的界面陷阱密度

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摘要

In this study, the interface trap density of metal-oxide-semiconductor (MOS) devices with Pr_2O_3 gate dielectric deposited on Si is determined by using a conductance method. In order to determine the exact value of the interface trap density, the series resistance is estimated directly from the impedance spectra of the MOS devices. Subsequently, the dispersion characteristics are numerically analyzed on the basis of a statistical model. Lastly, the process-dependent interface trap density of Pr_2O_3 is evaluated. It is concluded that high-pressure annealing and a superior quality interfacial SiO_2 layer are of crucial importance for achieving a sufficiently low interface trap density.
机译:在这项研究中,通过使用电导方法来确定在Si上沉积有Pr_2O_3栅极电介质的金属氧化物半导体(MOS)器件的界面陷阱密度。为了确定界面陷阱密度的准确值,可直接从MOS器件的阻抗谱中估算串联电阻。随后,基于统计模型对色散特性进行数值分析。最后,评估了与工艺有关的Pr_2O_3的界面陷阱密度。结论是,高压退火和高质量的界面SiO_2层对于实现足够低的界面陷阱密度至关重要。

著录项

  • 来源
    《Microelectronic Engineering》 |2011年第6期|p.872-876|共5页
  • 作者

    Sanghun Jeon; Sungho Park;

  • 作者单位

    Semiconductor Device Lab, Samsung Advanced Institute of Technology, Samsung Electronics Corporations, Nongseo-ri, Giheung-up, Yongin-si, Cyeonggi-Do 449-712,Republic of Korea;

    Department of Chemistry, Daejin University, Sundan-dong, Phochon-si, Kyunggi-do 487-711, Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    interface trap density; pr_2 o_3; gate dielectric; conductance method;

    机译:界面陷阱密度;pr_2 o_3;栅介质;电导法;

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