In a substrate cleaning device, with a polishing head in contact with one surface of a substrate rotated by a spin chuck, the polishing head is moved at least between a center and an outer periphery of the substrate. Thus, the one surface of the substrate is polished by the polishing head, and contaminants present on the one surface of the substrate are removed. At this time, capacity for removing contaminants by the polishing head is changed according to a position in a radial direction of the substrate. The capacity for removing contaminants refers to capacity for scraping contaminants adhering to the one surface of the substrate, and suction marks, contact marks and the like remaining on the one surface of the substrate by polishing. It is possible to change the capacity for removing contaminants by adjusting a pushing force exerted on the one surface of the substrate from the polishing head, for example.
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