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Effects of Varied Cleaning Methods on Ni-5 W Substrate for Dip-Coating of Water-based Buffer Layers: An X-ray Photoelectron Spectroscopy Study

机译:各种清洗方法对水基缓冲层浸涂Ni-5%W衬底的影响:X射线光电子能谱研究

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摘要

This work describes various combinations of cleaning methods involved in the preparation of Ni-5% W substrates for the deposition of buffer layers using water-based solvents. The substrate has been studied for its surface properties using X-ray photoelectron spectroscopy (XPS). The contaminants in the substrates have been quantified and the appropriate cleaning method was chosen in terms of contaminants level and showing good surface crystallinity to further consider them for depositing chemical solution-based buffer layers for Y1Ba2Cu3Oy (YBCO) coated conductors.
机译:这项工作描述了使用水基溶剂制备Ni-5%W衬底以制备缓冲层沉积所涉及的清洁方法的各种组合。已使用X射线光电子能谱(XPS)研究了基材的表面性能。已对基材中的污染物进行了定量,并根据污染物的含量选择了合适的清洁方法,并显示出良好的表面结晶度,以进一步考虑将它们用于沉积基于化学溶液的Y1Ba2Cu3Oy(YBCO)涂层导体缓冲层。

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