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METHODS OF MINIMIZING WAFER BACKSIDE DAMAGE IN SEMICONDUCTOR WAFER PROCESSING
METHODS OF MINIMIZING WAFER BACKSIDE DAMAGE IN SEMICONDUCTOR WAFER PROCESSING
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机译:最小化半导体晶圆加工中晶圆背面损伤的方法
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摘要
The present disclosure generally relates to substrate supports for semiconductor processing. In one embodiment, a substrate support is provided. The substrate support includes a body comprising a substrate chucking surface, an electrode disposed within the body, a plurality of substrate supporting features formed on the substrate chucking surface, wherein the number of substrate supporting features increases radially from a center of the substrate chucking surface to an edge of the substrate chucking surface, and a seasoning layer formed on the plurality of the substrate supporting features, the seasoning layer comprising a silicon nitride.
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