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LATERALLY DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

机译:横向扩散的金属氧化物半导体器件及其制造方法

摘要

A laterally diffused metal oxide semiconductor device and a fabrication method therefor. The laterally diffused metal oxide semiconductor device comprises: a substrate (10); a drift region (20) disposed in the substrate (10); a gate structure that is disposed on the substrate (10) and that comprises a gate dielectric layer (62) and a gate layer (64) on the gate dielectric layer (62); a drain region (40) that is disposed in the substrate (10) at one side of the gate structure and that is in contact with the drift region (20); a source region (50) disposed in the substrate (10) at the other side of the gate structure; and a gate-like structure (66) that is disposed between the gate structure and the drain region (40) above the drift region (20), a material of the gate-like structure (66) being the same as that of the gate layer (64), and the gate-like structure (66) being insulated from the gate layer (64).
机译:横向扩散的金属氧化物半导体器件及其制造方法。横向扩散的金属氧化物半导体器件包括:衬底(10);和基底(10)。漂移区(20)设置在基板(10)中;栅极结构,其设置在基板(10)上,并且包括栅极介电层(62)和在栅极介电层(62)上的栅极层(64);漏极区(40),其设置在栅极结构一侧的衬底(10)中并与漂移区(20)接触;在栅极结构的另一侧设置在衬底(10)中的源极区(50);以及在漂移区(20)上方的栅极结构和漏极区(40)之间设置的栅极结构(66),该栅极结构(66)的材料与栅极相同层(64),并且栅极状结构(66)与栅极层(64)绝缘。

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