首页> 外国专利> LATERAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF A LATERAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE, CAPABLE OF SUPPRESSING THE CONCENTRATION OF A HIGH VOLTAGE BIAS TO A GATE EDGE DUE TO THE STEP HEIGHT OF A DOUBLE TRENCH

LATERAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF A LATERAL DOUBLE DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE, CAPABLE OF SUPPRESSING THE CONCENTRATION OF A HIGH VOLTAGE BIAS TO A GATE EDGE DUE TO THE STEP HEIGHT OF A DOUBLE TRENCH

机译:横向双扩散金属氧化物半导体器件及其制造方法,能够将高偏置电压的浓度抑制到门边缘的高度达到几倍的高度,因此该横向双扩散金属氧化物半导体器件的制造方法

摘要

PURPOSE: A lateral double diffused metal oxide semiconductor device and a manufacturing method of a lateral double diffused metal oxide semiconductor device are provided to improve the operation reliability of a semiconductor by reducing the operation resistance of an LDMOS device.;CONSTITUTION: An oxidation film is formed on a semiconductor substrate(300). A first trench and a second trench are formed by etching a part of an oxide film and the semiconductor. A small trench is formed so that it is overlapped with the second trench. A stepped height is a dual trench of the second trench. An element isolation film for dividing semiconductor device area is formed on the first trench by burying an insulating layer.;COPYRIGHT KIPO 2010
机译:目的:提供一种横向双扩散金属氧化物半导体器件及其制造方法,以通过降低LDMOS器件的工作电阻来提高半导体的工作可靠性。形成在半导体衬底(300)上。通过刻蚀一部分氧化膜和半导体来形成第一沟槽和第二沟槽。形成小沟槽以使其与第二沟槽重叠。阶梯高度是第二沟槽的双沟槽。通过掩埋绝缘层在第一沟槽上形成用于隔离半导体器件区域的元件隔离膜。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20100006342A

    专利类型

  • 公开/公告日2010-01-19

    原文格式PDF

  • 申请/专利权人 DONGBU HITEK CO. LTD.;

    申请/专利号KR20080066539

  • 发明设计人 LEE YONG JUN;

    申请日2008-07-09

  • 分类号H01L21/76;H01L21/336;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:29

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