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Laterally diffused metal-oxide-semiconductor devices and fabrication methods thereof

机译:横向扩散的金属氧化物半导体器件及其制造方法

摘要

The present disclosure provides a laterally diffused metal-oxide-semiconductor (LDMOS) device. The LDMOS device includes a plurality of fin structures formed on a substrate including a first device region, a second device region, and an isolation region sandwiched between the two regions. An opening is formed in the fin structures in the isolation region. The LDMOS device further includes an isolation layer formed in the opening and covering the sidewall of the opening formed by a portion of each fin structure in the first device region. The isolation layer exposes top surfaces of the plurality of fin structures. Moreover, the LDMOS device also includes a gate structure formed across each fin structure in the first device region. The gate structure covers a portion of the sidewall and the top surfaces of the fin structure formed in the first device region and also covers the top surface of the isolation layer.
机译:本公开提供了一种横向扩散的金属氧化物半导体(LDMOS)器件。 LDMOS器件包括形成在衬底上的多个鳍结构,该衬底包括第一器件区域,第二器件区域以及夹在两个区域之间的隔离区域。在隔离区域中的鳍结构中形成开口。 LDMOS器件还包括隔离层,该隔离层形成在开口中并覆盖由第一器件区域中的每个鳍​​结构的一部分形成的开口的侧壁。隔离层暴露出多个鳍结构的顶表面。此外,LDMOS器件还包括跨第一器件区域中的每个鳍​​结构形成的栅极结构。栅极结构覆盖在第一器件区域中形成的鳍结构的侧壁的一部分和顶表面,并且还覆盖隔离层的顶表面。

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