首页> 外国专利> METHOD FOR BONDING SIC SINGLE CRYSTAL, METHOD FOR PRODUCING SIC INGOT, AND MOUNT FOR USE IN GROWTH OF SIC SINGLE CRYSTAL

METHOD FOR BONDING SIC SINGLE CRYSTAL, METHOD FOR PRODUCING SIC INGOT, AND MOUNT FOR USE IN GROWTH OF SIC SINGLE CRYSTAL

机译:Sic单晶的结合方法,Singo的生产方法以及用于Sic单晶生长的安装座

摘要

A method for bonding a SiC single crystal comprises: a measurement step of measuring the amount and direction of curvature of an atomic arrangement face of a SiC single crystal along at least a first direction that passes through the center in a plan view of the atomic arrangement face and a second direction that is orthogonal to the first direction; a provision step of providing a mount which has a curved surface that curves in the opposite direction from the atomic arrangement face of the SiC single crystal; and a bonding step of bonding the SiC single crystal to the mount in such a manner that the SiC single crystal and the mount face each other so that the direction of curvature of the atomic arrangement face and the direction of curvature of the curved surface can become different from each other.
机译:一种用于结合SiC单晶的方法,包括:测量步骤,沿着所述原子布置的平面图,沿着至少一个穿过中心的第一方向测量SiC单晶的原子布置面的量和曲率方向。面和与第一方向正交的第二方向;提供步骤:提供具有弯曲表面的底座,该弯曲表面在与SiC单晶的原子排列面相反的方向上弯曲;以及以使SiC单晶与安装件彼此相对的方式将SiC单晶结合到安装件的结合步骤,使得原子排列面的曲率方向和曲面的弯曲方向可以变成彼此不同。

著录项

  • 公开/公告号WO2020036167A1

    专利类型

  • 公开/公告日2020-02-20

    原文格式PDF

  • 申请/专利权人 SHOWA DENKO K.K.;

    申请/专利号WO2019JP31803

  • 发明设计人 FUJIKAWA YOHEI;TAKABA HIDETAKA;

    申请日2019-08-13

  • 分类号C30B29/36;C30B23/02;

  • 国家 WO

  • 入库时间 2022-08-21 11:13:24

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