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Research on Fatigue For AlN - Cu Plate Jointed By DBC Method For Semi-Conductor Substrate

机译：用于半导体基材的DBC方法疲劳对Aln - Cu板的疲劳研究

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Qiao Ling Zhang; Ting Ai; Hao Kang;
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1. Indirect bonding of Ni-electroless plated AlN and Cu by hot pressing method [J] . Chung-Daw Young, Jenq-Gong Duh IEEE transactions on components, packaging, and manufacturing technology. Part A . 1994,第4期

机译：热压法间接镀Ni化学镀AlN和Cu
2. Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil [J] . Yilian Huang, Renli Fu, Xudong Chen, Journal of materials science . 2021,第12期

机译：多孔铜层和AG箔促进了一种新型钎焊方法生产的ALN / Cu接头的界面强度和微观结构
3. Improving tensile and fatigue properties of Sn-58Bi/Cu solder joints through alloying substrate [J] . QingKe Zhang, HeFei Zou, Zhe-Feng Zhang Journal of Materials Research . 2010,第2期

机译：通过合金化基材改善Sn-58Bi / Cu焊点的拉伸和疲劳性能
4. Research on Fatigue For AlN - Cu Plate Jointed By DBC Method For Semi-Conductor Substrate [C] . Qiao Ling Zhang, Ting Ai, Hao Kang Joint International Advanced Engineering and Technology Research Conference . 2018

机译：用于半导体基材的DBC方法疲劳对Aln - Cu板的疲劳研究
5. Al-rich AlGaN and AlN Growth on Bulk AlN Single Crystal Substrates [D] . Bryan, Isaac S. 2015

机译：块状AlN单晶衬底上的富铝AlGaN和AlN生长
6. Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn–3.0Ag–0.5Cu/Cu Solder Joints during Electromigration [O] . Wu Yue, Chao Ding, Hongbo Qin, 2021

机译：Cu / Sn-3.0AG-0.5Cu / Cu / Cu / Cu / Cu焊点在电迁移期间锯齿状阴极溶解的结晶特征效应
7. Indirect bonding of Ni-electroless plated AlN and Cu by hot pressing method [O] . Chung-Daw Young 2011

机译：热压法间接镀Ni化学镀AlN和Cu
8. Sublimation Growth of AlN Single Crystal on AlN Coated SiC Substrate. Phase 1 [R] . Khan, M. A. 1995

机译：alN涂层siC衬底上alN单晶的升华生长。阶段1

Research on Fatigue For AlN - Cu Plate Jointed By DBC Method For Semi-Conductor Substrate

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