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Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study

机译：使用分子动力学研究的Ni / Cu多层高速研磨过程中的地下损伤和材料去除机制

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QiHong Fang; Qiong Wang; Jia Li; Xin Zeng; YouWen Liu;
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1. Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study [J] . Fang QiHong, Wang Qiong, Li Jia, RSC Advances . 2017,第67期

机译：使用分子动力学研究的Ni / Cu多层高速研磨过程中的地下损伤和材料去除机制
2. Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study [J] . QiHong Fang, Qiong Wang, Jia Li, RSC Advances . 2017,第67期

机译：镍/铜多层高速磨削过程中亚表面损伤和材料去除的机理的分子动力学研究
3. A molecular dynamics investigation into the mechanisms of subsurface damage and material removal of monocrystalline copper subjected to nanoscale high speed grinding [J] . Jia Li, Qihong Fang, Youwen Liu, Applied Surface Science . 2014,第juna1期

机译：分子动力学研究纳米高速研磨下单晶铜的表面损伤和材料去除机理
4. Atomic Insights into Material Removal Mechanisms in Si and Cu Chemical Mechanical Polishing Processes: ReaxFF Reactive Molecular Dynamics Simulations [C] . Jialin Wen, Tianbao Ma, Xinchun Lu, International Conference on Planarization/CMP Technology . 2017

机译：Si和Cu化学机械抛光工艺中的原子洞察材料去除机制：Reaxff反应性分子动力学模拟
5. Surface and Subsurface Damages in Rotary Ultrasonic Machining of Ceramics: A Molecular Dynamics Method with Experimental Study [D] . Ahmed, Yasser Hamouda. 2019

机译：陶瓷旋转超声加工的表面和地下损伤：实验研究的分子动力学方法
6. Molecular dynamics simulation of nanoindentation on Cu/Ni nanotwinned multilayer films using a spherical indenter [O] . Tao Fu, Xianghe Peng, Xiang Chen, -1

机译：使用球形压头在Cu / Ni纳米孪晶多层膜上纳米压痕的分子动力学模拟
7. Resistivity of Cu-Ni/Cu/Cu-Ni Multilayer Materials [O] . Keishi Nakamura, Yasunori Sakagami, Shiomi Kikuchi 2007

机译：用-NI /带/ Cu-Ni多层材料的电阻率
8. Compressive Strength and Damage Mechanisms in Ceramic Materials. I. The Role of Subcritical Tensile Microfracture Processes in Compression Failure of Ceramics. II. Electron Channeling Study of Fracture in Alumina-Evidence for Crac [R] . Lankford, J., Davidson, D. L. 1981

机译：陶瓷材料的抗压强度和损伤机理。 I.亚临界拉伸微裂缝过程在陶瓷压缩破坏中的作用。 II。氧化铝断裂的电子通道研究 - Crac的证据

Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study

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